Path: utzoo!utgpu!water!watmath!clyde!att!pacbell!lll-tis!helios.ee.lbl.gov!pasteur!ucbvax!decwrl!sun!pitstop!sundc!seismo!uunet!portal!cup.portal.com!mslater From: mslater@cup.portal.com Newsgroups: comp.arch Subject: Re: pad grid package Message-ID: <6783@cup.portal.com> Date: 23 Jun 88 02:21:28 GMT References: <2016@pt.cs.cmu.edu> Organization: The Portal System (TM) Lines: 15 XPortal-User-Id: 1.1001.4222 > pad array carriers for 88000 Motorola is indeed using these new packages for building their "HYPERmodules", which are ceramic substrates with 1-4 cpus and 2-8 cpmmus on them. The problem with this package is that it must be surface mounted, and visual inspection is not possible. I don't think there is any socket for it. Thus, Moto isn't selling bare chips in this package -- most users don't have the capability to use it. BTW, I've been told that this packaging technology was developed by Moto's cellular telephone group, which will build the HYPERmodules for the computer division. Michael Slater, Microprocessor Report sun!portal!cup.portal.com!mslater