Path: utzoo!utgpu!water!watmath!clyde!att!pacbell!lll-tis!helios.ee.lbl.gov!pasteur!ucbvax!decwrl!sun!pitstop!sundc!seismo!uunet!portal!cup.portal.com!mslater
From: mslater@cup.portal.com
Newsgroups: comp.arch
Subject: Re: pad grid package
Message-ID: <6783@cup.portal.com>
Date: 23 Jun 88 02:21:28 GMT
References: <2016@pt.cs.cmu.edu>
Organization: The Portal System (TM)
Lines: 15
XPortal-User-Id: 1.1001.4222

> pad array carriers for 88000

Motorola is indeed using these new packages for building their "HYPERmodules",
which are ceramic substrates with 1-4 cpus and 2-8 cpmmus on them.

The problem with this package is that it must be surface mounted, and
visual inspection is not possible.  I don't think there is any socket for it.
Thus, Moto isn't selling bare chips in this package -- most users don't have
the capability to use it.

BTW, I've been told that this packaging technology was developed by Moto's
cellular telephone group, which will build the HYPERmodules for the computer
division.

Michael Slater, Microprocessor Report   sun!portal!cup.portal.com!mslater