Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Path: utzoo!mnetor!uunet!seismo!rutgers!sri-spam!mordor!lll-tis!ptsfa!ski!dr From: dr@ski.UUCP (David Robins) Newsgroups: comp.sys.apple Subject: Re: Enhancing a //e Message-ID: <989@ski.UUCP> Date: Mon, 27-Jul-87 14:05:21 EDT Article-I.D.: ski.989 Posted: Mon Jul 27 14:05:21 1987 Date-Received: Tue, 28-Jul-87 07:32:47 EDT References: <870713175446.387036@DOCKMASTER.ARPA> Reply-To: dr@unix.UUCP (David Robins) Organization: Smith-Kettlewell Institute, S.F., CA. Lines: 28 In article <> dickow@ui3.UUCP writes: >In comp.sys.apple, Rankins@DOCKMASTER.ARPA asks about enhancing a IIe: > > the chips and not the sockets, then very carefully inserting > the new chips by putting in one side, then applying slight > sideways pressure until the next side of pins are lined up > enough to apply downward pressure to seat the chip in the > socket. >Bob Dickow (...egg-id!ui3!dickow) IC's are somewhat bent outwards, I believe for retension in auto-insertion equipment. I find a good way for manual insertion is to hold the IC on its side, with the pins lying on a flat surface. By holding the chip body by the ends, I can bend all the pins at the same time, reducing their obtuse angle to a right angle. I do the same on the other side, and I end up with all the pins at a right angle, which mates into the socket without any sideways pressure, and less chance of bending any of them. -- ==================================================================== David Robins, M.D. Smith-Kettlewell Eye Research Foundation (previously known as: Smith-Kettlewell Institute of Visual Sciences) 2232 Webster St; San Francisco CA 94115 415/561-1705 (voice) {ihnp4,qantel,dual}!ptsfa!ski!dr The opinions expressed herein do not reflect the opinion of the Institute!