Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP
Path: utzoo!mnetor!uunet!seismo!rutgers!sri-spam!mordor!lll-tis!ptsfa!ski!dr
From: dr@ski.UUCP (David Robins)
Newsgroups: comp.sys.apple
Subject: Re: Enhancing a //e
Message-ID: <989@ski.UUCP>
Date: Mon, 27-Jul-87 14:05:21 EDT
Article-I.D.: ski.989
Posted: Mon Jul 27 14:05:21 1987
Date-Received: Tue, 28-Jul-87 07:32:47 EDT
References: <870713175446.387036@DOCKMASTER.ARPA>
Reply-To: dr@unix.UUCP (David Robins)
Organization: Smith-Kettlewell Institute, S.F., CA.
Lines: 28

In article <> dickow@ui3.UUCP writes:
>In comp.sys.apple, Rankins@DOCKMASTER.ARPA asks about enhancing a IIe:
>
>             the chips and not the sockets, then very carefully inserting
>             the new chips by putting in one side, then applying slight
>             sideways pressure until the next side of pins are lined up
>             enough to apply downward pressure to seat the chip in the
>             socket.
>Bob Dickow (...egg-id!ui3!dickow)

IC's are somewhat bent outwards, I believe for retension in
auto-insertion equipment.  I find a good way for manual insertion is
to hold the IC on its side, with the pins lying on a flat surface.  By
holding the chip body by the ends, I can bend all the pins at the same
time, reducing their obtuse angle to a right angle.  I do the same on
the other side, and I end up with all the pins at a right angle, which
mates into the socket without any sideways pressure, and less chance
of bending any of them.
-- 
====================================================================
David Robins, M.D. 
Smith-Kettlewell Eye Research Foundation
(previously known as: Smith-Kettlewell Institute of Visual Sciences)
2232 Webster St; San Francisco CA 94115
415/561-1705 (voice)
			{ihnp4,qantel,dual}!ptsfa!ski!dr

The opinions expressed herein do not reflect the opinion of the Institute!