Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Posting-Version: notesfiles Path: utzoo!watmath!clyde!cbosgd!ihnp4!houxm!whuxlm!harpo!decvax!ittvax!dcdwest!sdcsvax!sdcrdcf!hplabs!hp-pcd!hp-lsd!paul From: paul@hp-lsd.UUCP (paul) Newsgroups: net.wanted Subject: Re: Orphaned Response Message-ID: <1700002@hp-lsd.UUCP> Date: Thu, 13-Dec-84 16:13:00 EST Article-I.D.: hp-lsd.1700002 Posted: Thu Dec 13 16:13:00 1984 Date-Received: Sun, 23-Dec-84 00:08:09 EST References: <-35700@mako.UUCP> Organization: Hewlett-Packard - Colorado Springs, CO Lines: 17 Nf-ID: #R:mako:-35700:hp-lsd:1700002:37777777600:595 Nf-From: hp-lsd!paul Dec 14 13:13:00 1984 RE: opening plastic DIPs I brought this to the attention of a hardware friend of mine. I had recalled EE labs where I had easily opened a DIP by electrical means and inquired about it. The reply: The best way to do this is to connect a very low impedence power supply so as to reverse-bias one of the junctions. The junction will vaporize and the vapor pressure opens the pack for you. (Note - this is lots of fun but watch for flying plastic!) --Paul Bame UUCP: {hplabs,ihnp4!hpfcla}!hp-lsd!paul CSNET: hp-lsd!paul@hp-labs.csnet ARPA: hp-lsd!paul&hp-labs@csnet-relay.arpa