Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP Path: utzoo!watmath!clyde!burl!ulysses!mhuxl!eagle!harpo!seismo!hao!hplabs!sri-unix!vomlehn@ut-ngp.ARPA From: vomlehn@ut-ngp.ARPA Newsgroups: net.micro.cpm Subject: Using cold-in-a-can products to isolate faults Message-ID: <17315@sri-arpa.UUCP> Date: Thu, 8-Mar-84 15:20:37 EST Article-I.D.: sri-arpa.17315 Posted: Thu Mar 8 15:20:37 1984 Date-Received: Sun, 11-Mar-84 01:28:51 EST Lines: 8 You should be careful when using one of those cold-in-a-can products to isolate heat-sensitive chips. Apparently someone took a look at these things and discovered that suddenly cooling down a hot chip can cause it to fail. This is not entirely suprising when you consider what happens when you put a hot glass jar into cold water; it cracks. I don't know if this person came up with actual figures for these cold- induced failures, but if you notice your board fails in a different way after cooling down a chip it may be that you now have TWO defective chips.